Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
SAM9X60D6K-I/4GB
 
2.022727
196
TFBGA
11x11x1.20mm
SAC105
e8
 
SAM9X60D6KT-I/4GB
 
0.604667
196
TFBGA
11x11x1.20mm
SAC105
e8
 
SAM9X60T-V/DWB
 
0.604667
228
TFBGA
11x11x1.2mm
SAC105
e8
 
SAM9X60-V/DWB
 
2.022727
228
TFBGA
11x11x1.2mm
SAC105
e8
 
SAM9X60D5M-I/4FB
 
2.420168
233
TFBGA
14x14x1.2mm
SAC105
e8
 
SAM9X60D5MT-I/4FB
 
0.922000
233
TFBGA
14x14x1.2mm
SAC105
e8
 
SAM9X60D1G-I/4FB
 
2.420168
233
TFBGA
14x14x1.2mm
SAC105
e8
 
SAM9X60D1GT-I/4FB
 
0.922000
233
TFBGA
14x14x1.2mm
SAC105
e8