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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC32MZ1025DAR169-I/6J
0.367300
2.011364
169
LFBGA
11x11x1.56mm
LF35
e8
download
PIC32MZ1025DAR169T-I/6J
0.367300
0.820000
169
LFBGA
11x11x1.56mm
LF35
e8
download