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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC32MX470F512H-I/PT
0.286700
2.487500
64
TQFP
10x10x1mm
Matte Tin
e3
download
PIC32MX470F512HT-I/PT
0.286700
0.574667
64
TQFP
10x10x1mm
Matte Tin
e3
download
PIC32MX470F512HT-V/PT
0.286700
0.574667
64
TQFP
10x10x1mm
Matte Tin
e3
download
PIC32MX470F512H-V/PT
0.286700
2.487500
64
TQFP
10x10x1mm
Matte Tin
e3
download
PIC32MX470F512H-120/PT
0.286700
2.487500
64
TQFP
10x10x1mm
Matte Tin
e3
download
PIC32MX470F512HT-120/PT
0.286700
0.574667
64
TQFP
10x10x1mm
Matte Tin
e3
download
PIC32MX470F512H-I/MR
0.232400
0.350000
64
QFN
9x9x0.9mm
Matte Tin
e3
download
PIC32MX470F512HT-I/MR
0.232400
0.370303
64
QFN
9x9x0.9mm
Matte Tin
e3
download
PIC32MX470F512HT-V/MR
0.232400
0.370303
64
QFN
9x9x0.9mm
Matte Tin
e3
download
PIC32MX470F512H-V/MR
0.232400
0.350000
64
QFN
9x9x0.9mm
Matte Tin
e3
download
PIC32MX470F512H-120/MR
0.232400
0.350000
64
QFN
9x9x0.9mm
Matte Tin
e3
download
PIC32MX470F512HT-120/MR
0.232400
0.370303
64
QFN
9x9x0.9mm
Matte Tin
e3
download