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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC32MX330F064L-I/TL
0.177500
0.325000
124
VTLA
9x9x0.9mm
NiPdAu
e4
download
PIC32MX330F064LT-I/TL
0.177500
0.331515
124
VTLA
9x9x0.9mm
NiPdAu
e4
download
PIC32MX330F064LT-V/TL
0.177500
0.331515
124
VTLA
9x9x0.9mm
NiPdAu
e4
download
PIC32MX330F064L-V/TL
0.177500
0.325000
124
VTLA
9x9x0.9mm
NiPdAu
e4
download
PIC32MX330F064L-I/PF
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
download
PIC32MX330F064L-I/PT
0.391000
1.596639
100
TQFP
12x12x1mm
Matte Tin
e3
download
PIC32MX330F064LT-I/PF
0.497000
1.199000
100
TQFP
14x14x1mm
Matte Tin
e3
download
PIC32MX330F064LT-V/PF
0.497000
1.199000
100
TQFP
14x14x1mm
Matte Tin
e3
download
PIC32MX330F064L-V/PF
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
download
PIC32MX330F064LT-I/PT
0.391000
1.333333
100
TQFP
12x12x1mm
Matte Tin
e3
download
PIC32MX330F064LT-V/PT
0.391000
1.333333
100
TQFP
12x12x1mm
Matte Tin
e3
download
PIC32MX330F064L-V/PT
0.391000
1.596639
100
TQFP
12x12x1mm
Matte Tin
e3
download