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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC32MX254F128B-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
PIC32MX254F128BT-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
PIC32MX254F128B-V/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
PIC32MX254F128BT-V/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
PIC32MX254F128B-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC32MX254F128BT-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC32MX254F128BT-V/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC32MX254F128B-V/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download