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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC32MM0256GPM028-E/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC32MM0256GPM028-I/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC32MM0256GPM028T-I/MLVAO
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC32MM0256GPM028-I/MLVAO
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC32MM0256GPM028T-I/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC32MM0256GPM028-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
PIC32MM0256GPM028-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
PIC32MM0256GPM028T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
download
PIC32MM0256GPM028-E/SSVAO
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
PIC32MM0256GPM028-E/M6
0.026500
0.109890
28
UQFN
4x4x0.6mm
Matte Tin
e3
download
PIC32MM0256GPM028-I/M6
0.026500
0.109890
28
UQFN
4x4x0.6mm
Matte Tin
e3
download
PIC32MM0256GPM028T-I/M6
0.026500
0.212121
28
UQFN
4x4x0.6mm
Matte Tin
e3
download