Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC24HJ64GP202-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC24HJ64GP202-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
PIC24HJ64GP202T-E/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
PIC24HJ64GP202-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
PIC24HJ64GP202T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
PIC24HJ64GP202-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC24HJ64GP202T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC24HJ64GP202T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC24HJ64GP202-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
PIC24HJ64GP202-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download