Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC24F08KL201-E/MQ
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
download
PIC24F08KL201-I/MQ
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
download
PIC24F08KL201T-I/MQ
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3
download
PIC24F08KL201-I/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC24F08KL201-E/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC24F08KL201T-I/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC24F08KL201-I/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
PIC24F08KL201-I/P
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download