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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC18LF2525-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC18LF2525-I/SOVAO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC18LF2525T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC18LF2525T-I/SOVAO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC18LF2525-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download