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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC18F26Q10T-I/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC18F26Q10-I/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC18F26Q10-E/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC18F26Q10-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
PIC18F26Q10-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
PIC18F26Q10T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
download
PIC18F26Q10-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC18F26Q10-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC18F26Q10T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC18F26Q10-E/STX
0.042600
0.109890
28
VQFN
4x4x1.0mm
Matte Tin
e3
download
PIC18F26Q10-I/STX
0.042600
0.109890
28
VQFN
4x4x1.0mm
Matte Tin
e3
download
PIC18F26Q10T-I/STX
0.042600
0.212121
28
VQFN
4x4x1.0mm
Matte Tin
e3
download
PIC18F26Q10-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
PIC18F26Q10-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download