RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC18F2523-I/SPREL
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
PIC18F2523-E/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC18F2523-I/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC18F2523T-I/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
download
PIC18F2523-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC18F2523-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC18F2523T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC18F2523-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
PIC18F2523-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download