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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC16F818T-E/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16F818T-I/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16F818T-I/SSTSL
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16F818T-E/SO
0.481000
1.000909
18
SOIC
.300in
Matte Tin
e3
download
PIC16F818T-I/SO
0.481000
1.000909
18
SOIC
.300in
Matte Tin
e3
download