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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC16F677-E/ML
0.043100
0.076923
20
QFN
4x4x0.9mm
Matte Tin
e3
download
PIC16F677-I/ML
0.043100
0.076923
20
QFN
4x4x0.9mm
Matte Tin
e3
download
PIC16F677T-I/ML
0.043100
0.212121
20
QFN
4x4x0.9mm
Matte Tin
e3
download
PIC16F677-E/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16F677-I/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16F677-I/SSVAO
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16F677T-E/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16F677T-I/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16F677T-I/SSV05
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16F677T-I/SSVAO
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16F677-E/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
PIC16F677-I/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
PIC16F677T-I/SO
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
download
PIC16F677-E/P
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download
PIC16F677-I/P
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download