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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC16F1773T-E/MX
0.002900
0.181212
28
UQFN
6x6x0.5mm
Matte Tin
e3
download
PIC16F1773-E/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
download
PIC16F1773-I/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
download
PIC16F1773T-I/MX
0.002900
0.181212
28
UQFN
6x6x0.5mm
Matte Tin
e3
download
PIC16F1773-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
PIC16F1773-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
PIC16F1773T-E/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
download
PIC16F1773T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
download
PIC16F1773-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC16F1773-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
PIC16F1773T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
PIC16F1773-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
PIC16F1773-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download