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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC16F1618-E/ML
0.043100
0.076923
20
QFN
4x4x0.9mm
Matte Tin
e3
download
PIC16F1618-I/ML
0.043100
0.076923
20
QFN
4x4x0.9mm
Matte Tin
e3
download
PIC16F1618T-I/ML
0.043100
0.212121
20
QFN
4x4x0.9mm
Matte Tin
e3
download
PIC16F1618-E/GZ
0.020700
0.065934
20
UQFN
4x4x0.5mm
Matte Tin
e3
download
PIC16F1618-I/GZ
0.020700
0.065934
20
UQFN
4x4x0.5mm
Matte Tin
e3
download
PIC16F1618T-I/GZ
0.020700
0.181818
20
UQFN
4x4x0.5mm
Matte Tin
e3
download
PIC16F1618-E/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16F1618-I/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16F1618T-I/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16F1618-E/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
PIC16F1618-I/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
PIC16F1618T-I/SO
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
download
PIC16F1618-E/P
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download
PIC16F1618-I/P
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download