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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC16F15323-E/JQ
0.022500
0.065934
16
UQFN
4x4x0.5mm
Matte Tin
e3
download
PIC16F15323-I/JQ
0.022500
0.065934
16
UQFN
4x4x0.5mm
Matte Tin
e3
download
PIC16F15323T-E/JQ
0.022500
0.181818
16
UQFN
4x4x0.5mm
Matte Tin
e3
download
PIC16F15323T-I/JQ
0.022500
0.181818
16
UQFN
4x4x0.5mm
Matte Tin
e3
download
PIC16F15323-E/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
download
PIC16F15323-I/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
download
PIC16F15323T-E/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
download
PIC16F15323T-I/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
download
PIC16F15323-E/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
PIC16F15323-I/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
PIC16F15323T-I/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
PIC16F15323-E/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download
PIC16F15323-I/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download