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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC16C770/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16C770-I/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16C770T/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
download
PIC16C770/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
PIC16C770-I/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
download
PIC16C770/P
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download
PIC16C770/PHXX
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download
PIC16C770-I/P
1.512900
2.833333
20
PDIP
.300in
Matte Tin
e3
download