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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
PIC16C558-04/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16C558-20I/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16LC558-04/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
download
PIC16LC558-04/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
PIC16C558-04/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
PIC16C558-04I/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
PIC16C558-20/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
PIC16C558-04I/SOVAO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
PIC16C558-04/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download
PIC16C558-04E/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download
PIC16C558-04I/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download
PIC16C558-20/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download