Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC59300-1.2YME
0.078000
0.185790
8
SOIC
3.9mm
Matte Tin
e3
download
MIC59300-1.2YME-TR
0.078000
0.700602
8
SOIC
3.9mm
Matte Tin
e3
download
MIC59300YME
0.078000
0.185790
8
SOIC
3.9mm
Matte Tin
e3
download
MIC59300YME-TR
0.078000
0.700602
8
SOIC
3.9mm
Matte Tin
e3
download
MIC59300-1.2WU
1.462500
2.520000
5
DDPAK
-
Matte Tin
e3
download
MIC59300-1.2WU-TR
1.462500
2.053333
5
DDPAK
-
Matte Tin
e3
download
MIC59300WU
1.462500
2.520000
5
DDPAK
-
Matte Tin
e3
download
MIC59300WU-TR
1.462500
2.053333
5
DDPAK
-
Matte Tin
e3
download