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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC5841YWM-TR
0.481000
1.000909
18
SOIC
.300in
Matte Tin
e3
download
MIC5841YV
0.751700
1.428571
20
PLCC
8.9x8.9x4.4mm
Matte Tin
e3
download
MIC5841YV-TR
0.751700
1.360000
20
PLCC
8.9x8.9x4.4mm
Matte Tin
e3
download
MIC5841YWM
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
MIC5841YN
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download