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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC5158CYP
0.000000
1000.000
0
DICE
Varies
-
-
 
MIC5158CYW
0.000000
1000.000
0
WAFER
Varies
-
-
 
MIC5158YM
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MIC5158YM-TR
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MIC5158YN
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download