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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC5156CYW
0.000000
1000.000
0
WAFER
Varies
-
-
 
MIC5156CYW-8
0.000000
1000.000
0
WAFER
Varies
-
-
 
MIC5156-5.0YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC5156-5.0YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC5156-3.3YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC5156-3.3YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC5156YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC5156YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC5156-3.3YN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MIC5156-5.0YN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MIC5156YN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download