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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC4468CYP
0.000000
1000.000
0
DICE
Varies
-
-
 
MIC4468CYW
0.000000
1000.000
0
WAFER
Varies
-
-
 
MIC4468CYW-8
0.000000
1000.000
0
WAFER
Varies
-
-
 
MIC4468YWM
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
MIC4468YWM-TR
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
MIC4468ZWM
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
MIC4468ZWM-TR
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
MIC4468YN
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download
MIC4468ZN
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download