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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC4467YWM
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
MIC4467YWM-TR
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
MIC4467ZWM-TR
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
MIC4467ZWM
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
MIC4467ZN
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download