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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC4422YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4422YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4422AYM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4422AZM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4422AZM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4422ZM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4422ZM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4422AYM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4422AZN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MIC4422YN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MIC4422ZN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MIC4422AYN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MIC4422AZT
1.983900
3.120000
5
TO-220
-
Matte Tin
e3
download
MIC4422ZT
1.983900
3.120000
5
TO-220
-
Matte Tin
e3
download