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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC4421CYW-8
0.000000
0.000000
0
Wafer
Varies
-
-
 
MIC4421CYP
0.000000
1000.000
0
DICE
Varies
-
-
 
MIC4421CYW
0.000000
1000.000
0
WAFER
Varies
-
-
 
MIC4421YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4421ZM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4421YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4421ZM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC4421ZN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MIC4421YN
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MIC4421ZT
1.983900
3.120000
5
TO-220
 
Matte Tin
e3
download