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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC3808YMM
0.025100
0.124600
8
MSOP
3x3mm
NiPdAu
e4
download
MIC3808YMM-TR
0.025100
0.334700
8
MSOP
3x3mm
NiPdAu
e4
download
MIC3808YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC3808YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download