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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC3385YHL-TR
0.000000
0.075605
14
VQFN
3.5x3.0x1mm
NiPdAu
e4
 
MIC3385-1.5YHL-TR
0.000000
0.075605
14
VQFN
3.5x3.0x1mm
NiPdAu
e4