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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC3231YTSE-TR
 
0.238548
16
TSSOP
4.4mm
Matte Tin
e3
 
MIC3231YTSE
 
0.163511
16
TSSOP
4.4mm
Matte Tin
e3
 
MIC3231YML-TR
0.023840
0.644302
12
VDFN
3x3x0.9mm
NiPdAu
e4
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