Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC2547-1YTS
0.065000
0.125000
16
TSSOP
4.4mm
Matte Tin
e3
download
MIC2547-1YTS-TR
0.065000
0.204000
16
TSSOP
4.4mm
Matte Tin
e3
download
MIC2547-2YTS
0.065000
0.125000
16
TSSOP
4.4mm
Matte Tin
e3
download
MIC2547-2YTS-TR
0.065000
0.204000
16
TSSOP
4.4mm
Matte Tin
e3
download
MIC2547-1YM
0.157400
0.300000
16
SOIC
.150in
Matte Tin
e3
download
MIC2547-2YM
0.157400
0.300000
16
SOIC
.150in
Matte Tin
e3
download
MIC2547-2YM-TR
0.157400
0.307692
16
SOIC
.150in
Matte Tin
e3
download
MIC2547-1YM-TR
0.157400
0.307692
16
SOIC
.150in
Matte Tin
e3
download