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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC2012-1PZQS
0.083600
0.160000
16
QSOP
3.90mm(.150in)
Matte Tin
e3
download
MIC2012-1PZQS-TR
0.083600
0.320000
16
QSOP
3.90mm(.150in)
Matte Tin
e3
download
MIC2012-2PZQS
0.083600
0.160000
16
QSOP
3.90mm(.150in)
Matte Tin
e3
download
MIC2012-2PZQS-TR
0.083600
0.320000
16
QSOP
3.90mm(.150in)
Matte Tin
e3
download
MIC2012YM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC2012YM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC2012ZM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC2012ZM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC2012PZM
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
MIC2012PZM-TR
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download