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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MIC2009YML-TR
0.010100
0.662100
6
VDFN
2x2x0.9mm
NiPdAu
e4
download
MIC2009A-1YM6-TR
0.016450
0.046667
6
SOT-23
-
NiPdAu
e4
download
MIC2009YM6-TR
0.016450
0.046667
6
SOT-23
-
NiPdAu
e4
download
MIC2009A-2YM6-TR
0.016450
0.046667
6
SOT-23
-
NiPdAu
e4
download