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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MEC1609I-PZV
0.251500
0.480769
144
TFBGA
7x7x1.0
SAC
e1
download
MEC1609-PZV
0.251500
0.480769
144
TFBGA
7x7x1.0
SAC
e1
download
MEC1609I-PZP
0.355000
1.125000
144
LFBGA
10x10x1.4
SAC
e8
download
MEC1609-PZP
0.355000
1.125000
144
LFBGA
10x10x1.4
SAC
e8
download