Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP79402-I/S16K
0.000000
1000.000
0
DICE
Varies
-
-
 
MCP79402-I/W16K
0.000000
1000.000
0
WAFER
Varies
-
-
 
MCP79402-I/WF16K
0.000000
1000.000
0
WAFER
Varies
-
-
 
MCP79402-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP79402T-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP79402T-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP79402T-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
MCP79402-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
MCP79402-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP79402T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download