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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP73862-I/MLG
0.041700
0.076923
16
QFN
4x4x0.9mm
Matte Tin
e3
 
MCP73862T-I/ML
0.041700
0.212121
16
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP73862-I/ML
0.041700
0.076923
16
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP73862-I/MLRB2
0.041700
0.076923
16
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP73862T-I/MLRB2
0.041700
0.212121
16
QFN
4x4x0.9mm
Matte Tin
e3
download
MCP73862-I/SL
0.157400
0.300000
16
SOIC
.150in
Matte Tin
e3
download
MCP73862T-I/SL
0.157400
0.307692
16
SOIC
.150in
Matte Tin
e3
download
MCP73862-I/SLRB2
0.157400
0.300000
16
SOIC
.150in
Matte Tin
e3
download
MCP73862T-I/SLRB2
0.157400
0.307692
16
SOIC
.150in
Matte Tin
e3
download