Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP73223-C0SI/MF
0.023900
0.041667
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223-C2AI/MF
0.023900
0.041667
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223-C2HI/MF
0.023900
0.041667
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223-C2SI/MF
0.023900
0.041667
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223-C2TI/MF
0.023900
0.041667
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223-CAGI/MF
0.023900
0.041667
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223-CAHI/MF
0.023900
0.041667
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223T-C0SI/MF
0.023900
0.234849
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223T-C2AI/MF
0.023900
0.234849
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223T-C2HI/MF
0.023900
0.234849
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223T-C2SI/MF
0.023900
0.234849
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223T-C2TI/MF
0.023900
0.234849
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223T-CAGI/MF
0.023900
0.234849
10
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP73223T-CAHI/MF
0.023900
0.234849
10
DFN
3x3x0.9mm
Matte Tin
e3
download