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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP6V02-E/MD
0.043200
0.076923
8
DFN
4x4x0.9mm
Matte Tin
e3
download
MCP6V02T-E/MD
0.043200
0.212121
8
DFN
4x4x0.9mm
Matte Tin
e3
download
MCP6V02-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6V02T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6V02T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download