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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP621T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP621-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP621T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP621ST-E/OTVAO
0.017000
0.066667
5
SOT-23
-
Matte Tin
e3
download
MCP621ST-E/OT
0.017000
0.066667
5
SOT-23
-
Matte Tin
e3
download