Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP6142-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP6142-E/MSVAO
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP6142-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP6142T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP6142T-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP6142T-E/MSVAO
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP6142-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6142-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6142T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6142T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6142-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MCP6142-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download