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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP6071T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP6072T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP6074-E/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
download
MCP6074T-E/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
download
MCP607-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
MCP607T-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
MCP6074T-E/STVAO
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
download
MCP6074-E/STVAO
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
download
MCP6071-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6071T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6072-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6072T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6072T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP607-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP607T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6074-E/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6074T-E/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP6071T-E/OT
0.017000
0.066667
5
SOT-23
-
Matte Tin
e3
download
MCP6071T-E/OTVAO
0.017000
0.066667
5
SOT-23
-
Matte Tin
e3
download
MCP607-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download