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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP606-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
MCP606T-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
MCP606-I/SN
0.078000
0.250000
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
MCP606T-I/SN
0.078000
0.230303
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
MCP606T-I/OT
0.016000
0.049000
5
SOT-23
-
Matte Tin
e3
download
MCP606-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download