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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP4726A0T-E/MAY
0.014800
0.258333
6
DFN
2x2x0.9mm
NiPdAu
e4
download
MCP4726A1T-E/MAY
0.014800
0.258333
6
DFN
2x2x0.9mm
NiPdAu
e4
download
MCP4726A2T-E/MAY
0.014800
0.258333
6
DFN
2x2x0.9mm
NiPdAu
e4
download
MCP4726A3T-E/MAY
0.014800
0.258333
6
DFN
2x2x0.9mm
NiPdAu
e4
download
MCP4726A0T-E/CH
0.017000
0.046667
6
SOT-23
 
Matte Tin
e3
download
MCP4726A1T-E/CH
0.017000
0.046667
6
SOT-23
 
Matte Tin
e3
download
MCP4726A2T-E/CH
0.017000
0.046667
6
SOT-23
 
Matte Tin
e3
download
MCP4726A3T-E/CH
0.017000
0.046667
6
SOT-23
 
Matte Tin
e3
download
MCP4726-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download