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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP4531-103E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP4531-104E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP4531-502E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP4531-503E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP4531T-103E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP4531T-104E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP4531T-502E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP4531T-503E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP4531T-103E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP4531T-104E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP4531T-502E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP4531T-503E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
download