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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP37210-200I/TL
0.177500
0.325000
124
VTLA
9x9x0.9mm
NiPdAu
e4
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MCP37210-200I/TE
 
1.928161
121
SiP
8x8x1.08mm
SAC
e1