Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP3464R-E/ST
0.078000
0.175676
20
TSSOP
4.4mm
Matte Tin
e3
download
MCP3464RT-E/ST
0.078000
0.200000
20
TSSOP
4.4mm
Matte Tin
e3
download
MCP3464RT-E/NC
0.020530
0.151333
20
UQFN
3x3x0.55mm
Matte Tin
e3
download