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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP33111-10-E/MS
0.023200
0.060000
10
MSOP
3x3mm
Matte Tin
e3
download
MCP33111-10T-E/MS
0.023200
0.200000
10
MSOP
3x3mm
Matte Tin
e3
download
MCP33111-10-E/MN
0.021000
0.041667
10
TDFN
3x3x0.8mm
Matte Tin
e3
download
MCP33111-10T-E/MN
0.021000
0.228788
10
TDFN
3x3x0.8mm
Matte Tin
e3
download