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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP3304-BI/SL
0.157400
0.300000
16
SOIC
.150in
Matte Tin
e3
download
MCP3304-CI/SL
0.157400
0.300000
16
SOIC
.150in
Matte Tin
e3
download
MCP3304T-BI/SL
0.157400
0.307692
16
SOIC
.150in
Matte Tin
e3
download
MCP3304T-CI/SL
0.157400
0.307692
16
SOIC
.150in
Matte Tin
e3
download
MCP3304-BI/P
1.112700
1.833333
16
PDIP
.300in
Matte Tin
e3
download
MCP3304-CI/P
1.112700
1.833333
16
PDIP
.300in
Matte Tin
e3
download