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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP3201/S
0.000000
1000.000
0
DICE
Varies
-
-
 
MCP3201/W
0.000000
1000.000
0
WAFER
Varies
-
-
 
MCP3201/WF
0.000000
1000.000
0
WAFER
Varies
-
-
 
MCP3201-CI/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
MCP3201T-CI/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
MCP3201-CI/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
MCP3201T-CI/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
MCP3201-BI/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3201-BI/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3201-CI/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3201-CI/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3201T-BI/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3201T-CI/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3201T-CI/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3201-BI/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
MCP3201-CI/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download