Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP3004-I/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
download
MCP3004-I/STVAO
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
download
MCP3004T-I/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
download
MCP3004T-I/STVAO
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
download
MCP3004-I/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3004T-I/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3004T-I/SLVAO
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP3004-I/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download