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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP2544FDT-H/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP2544FDT-H/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP2544FD-E/MF
0.023800
0.041667
8
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP2544FDT-E/MF
0.023800
0.172727
8
DFN
3x3x0.9mm
Matte Tin
e3
download
MCP2544FDT-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
MCP2544FD-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2544FD-H/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2544FDT-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
MCP2544FDT-H/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download